Semi Automatic BGA Rework Station with ±0.01mm Mounting Accuracy, Real-time Curve Analysis, and Independent Three-zone Control for PCB Rework

Product Description:

The Semi Automatic BGA Rework Station is a highly efficient and reliable tool designed for precise and effective reworking of Ball Grid Array (BGA) components. This advanced rework station integrates a sophisticated heating system featuring a three heating zone configuration, which significantly enhances the control and uniformity of the reflow process. By combining upper and lower hot air heating with bottom infrared (IR) preheating, this product ensures optimal temperature distribution, minimizing the risk of component damage and improving solder joint quality.

One of the most notable features of this Semi Automatic BGA Rework Station is its three heating zone design. The upper and lower hot air heating elements provide targeted and adjustable airflow, enabling uniform heat application to the BGA components and surrounding PCB area. Meanwhile, the bottom IR preheating zone gently raises the temperature of the entire board, reducing thermal stress and preventing warping or delamination. This comprehensive heating approach allows for precise thermal profiles that are essential for successful BGA rework tasks.

Operating the Semi Automatic BGA Rework Station is straightforward thanks to its semi-automatic functionality, which strikes an ideal balance between manual control and automation. Users can set specific parameters and monitor the reflow process with ease, ensuring consistent results while maintaining flexibility to adjust settings based on the unique requirements of different components and boards. This feature makes it suitable for both small-scale repairs and larger production environments.

Accuracy is critical in BGA rework, and this station delivers exceptional mounting precision with a mounting accuracy of ±0.01mm. This high degree of accuracy ensures that BGA components are positioned perfectly before reflow, which is crucial for achieving reliable solder joints and preventing defects such as bridging or insufficient soldering. The precision mounting system enhances the overall efficiency of the rework process and reduces the likelihood of rework or component failure.

The power supply for the Semi Automatic BGA Rework Station is robust and stable, operating on AC 220V ± 10%, 50/60Hz. This ensures consistent power delivery to all heating zones and control systems, enabling reliable performance throughout extended operation periods. The station’s build quality is further reflected in its substantial net weight of 55 kg, which provides stability during the rework process and reduces vibration that could affect component placement or heating uniformity.

The machine also features a temperature measuring interface with one sensor included, allowing users to monitor the temperature accurately throughout the reflow process. This real-time temperature feedback is essential for fine-tuning the heating profile and ensuring that the BGA components and PCB are heated within safe and effective temperature ranges. The temperature measuring interface enhances the safety and effectiveness of the rework operation.

In summary, the Semi Automatic BGA Rework Station with its three heating zone system offers a powerful combination of precision, control, and versatility. Its upper and lower hot air heating coupled with bottom IR preheating ensures superior heat distribution, while the high mounting accuracy and semi-automatic operation facilitate efficient, high-quality rework of BGA components. Designed for professionals who demand consistent results and reliable performance, this rework station is an essential tool in electronics manufacturing and repair.

Features:

• Product Name: Semi Automatic BGA Rework Station
• Packaging Type: Wooden Box
• Machine Weight: Net Weight 55 Kg
• Heating Zones: Three Independent Heating Zones
• Dimensions: L605 × W655 × H710 Mm
• Touch Screen: High-definition Touchscreen HMI
• Equipped with an infrared preheating table for efficient and uniform heating
• Advanced hot air heating system for precise temperature control
• Designed specifically as a reliable BGA rework station for PCB repair and rework

Technical Parameters:

Applications:

The Wisdomshow WDS-620 Semi Automatic BGA Rework Station is an advanced and versatile tool designed to meet the demanding needs of electronics repair and manufacturing industries. Originating from China and certified with CE standards, this BGA rework station combines precision, efficiency, and user-friendly operation, making it an essential device for professionals working with ball grid array (BGA) components.

This BGA rework station is ideal for various application occasions and scenarios where high accuracy and reliability are paramount. Equipped with a sophisticated optical alignment system, the WDS-620 ensures precise positioning of BGA chips during the rework process, significantly reducing errors and enhancing soldering quality. This makes it perfectly suited for repairing and assembling motherboards, graphics cards, smartphones, gaming consoles, and other electronic devices that utilize BGA packages.

Thanks to its five working modes—Disassembly, Soldering, Placement, Semi-automatic, and Manual—the Wisdomshow WDS-620 offers great flexibility for different repair tasks. Whether you are desoldering defective chips, reflow soldering BGA components, or placing new parts, this station adapts seamlessly to your workflow. Its high-definition touchscreen HMI provides an intuitive interface for precise temperature control and process adjustments, granting operators full command over the rework process.

With a robust build, measuring L605 × W655 × H710 mm and packaged securely in a wooden box for safe delivery, the WDS-620 is ready for immediate deployment. The inclusion of a temperature measuring interface ensures accurate thermal profiling, which is critical for avoiding heat damage during delicate rework operations. The station’s semi-automatic functionality balances automation and manual control, enhancing efficiency without sacrificing accuracy.

Ideal for electronics repair shops, manufacturing lines, quality control labs, and educational institutions, the Wisdomshow WDS-620 BGA rework station supports a minimum order quantity of one unit, with a supply ability of 200 units and a prompt delivery time of 3-5 days. Payment terms are convenient with TT options available, making it accessible for businesses of various scales.

In summary, the Wisdomshow WDS-620 Semi Automatic BGA Rework Station is designed for scenarios demanding precision BGA rework, combining advanced optical alignment system technology with versatile working modes and user-friendly controls. It stands as a reliable solution for improving productivity and ensuring high-quality electronic repairs and assembly.